Sputtering Targets - Target Bonding
◉ Pure Metals
◉ Compounds/ Alloys
◉ Target Bonding
Depending on the particular system and material your target may require bonding. Backing plates can be fabricated to match virtually any target composition and configuration. We will perform bonding/de-bonding of targets ordered from us or of targets and backing plates provided by the customer.
Indium is the preferred solder for bonding sputtering targets because it has the best thermal conductivity.The softer solder allows some "give" when the target expands at a different rate than the backing plate.
The main limitation of the indium bond is the melting temperature of the indium solder. Indium has a melting point of 157°C so temperatures in excess of 150°C will cause the bond to melt and fail. Most materials can be indium bonded but there are a few exceptions.